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For example, an inert fluid boils at 230 ° C and forms a vapor layer above it at 230 ° C. This allows the welded parts to remain sealed in a neutral atmosphere. Because steam has a higher density, it is heavier than the surrounding air. In the gas phase furnace, the limitation of physical temperature can reliably prevent the overheating of any parts in the welding process. This makes the process very suitable for densely populated PCB. This process produces a small temperature difference between components with different thermal qualities on PCB. High heat transfer rate, good wettability, much less power input required. When the component is located in it, the steam layer transfers heat to the PCB and related components. Compared with the convection reflow soldering furnace, the gas phase reflow soldering furnace occupies a much smaller area, and the PCB assembly moves vertically up and down rather than laterally. The steam comes from boiling perfluoropolyether, an inert heat transfer liquid. Unlike convection, this type of oven uses condensation or vapor phase welding. However, each product needs its own backflow curve, which the engineering team must create before starting production. The production line of the printed circuit board is usually placed in the convection reflux between the line and the SMT assembly equipment furnace, thus allowing relatively high throughput without additional processing. Although each heating zone has its own temperature control, engineers often face challenges when refluxing dense circuit boards in a convection reflow furnace, because it is impossible to control the temperature at a single element level. Finally, PCB assemblers obtain the highest possible PCB soldering results.Ĭonvection reflow furnace usually occupies a large area, so it occupies a large area in the factory. In addition, the entire welding process is performed in an inert atmosphere.
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This welding process provides ideal detail wetting. Vapor reflow soldering ensures that the PCB board and its components will not be exposed to temperatures higher than necessary. This is a complicated process, and as electronic components become smaller and smaller, it becomes more challenging. To solder electronic components to the PCB, manufacturers usually require high temperatures. In recent years, this technology has become popular among large PCB assemblers. Vapour reflow refers to an advanced PCB soldering technology that uses an inert liquid with a high boiling point.